The
high temperature produced in high density and high speed operation following
Moore’s Law in Semiconductor industry is one barrier which is hard to get rid
of. New material and new method of packaging test can improve these issues. It
becomes more important to monitor the stress and strain of the molds or
fixtures for that the temperature stability and the exerting force uniformity
of the molds or fixtures are highly requested on these operation processes.
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Examples
of the applications:
1
Three point bending test on the packaged PC board.
2
Drop impact test on the packaged PC board.
3
structural stress / strain measurement between
the chip and the PCB.
4 Exerting force
monitoring on the packaging machine.